• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A printed circuit board (100), comprising a base layer (110) having a top and a bottom (120, 130), wherein at least the top (120) at least a first layer (150) of conductor tracks (200) provided for current conduction and at least a first and a second component (310, 320), wherein in each case one component (310, 320, 330, 340) at least two printed conductors (200) are associated with the drive, wherein the next adjacent printed conductors (200) on each side ( 120, 130) of the base layer (110) have interfaces (210) spaced from one another for mutual electrical insulation, wherein at least the interface (210) of a conductor (200) of the first component (310) at least in sections forms a first set of projections (401, 501). and the interface (210) of a next adjacent conductive line (200) of the second component (320) at least in sections a second set of projections (402, 502), wherein the first set of projections (401, 501) and d the second set of projections (402, 501) complement each other.
    公开号:AT519741A4
    申请号:T50601/2017
    申请日:2017-07-18
    公开日:2018-10-15
    发明作者:Edlinger Erik
    申请人:Zkw Group Gmbh；
    IPC主号:
    专利说明:

    THERMAL COUPLING OF COPPER SPREADING SURFACES
    The invention relates to a printed circuit board, comprising a base layer having a top and a bottom, wherein at least the top has at least a first layer of conductor tracks provided for current conduction and at least a first and a second electrical component, wherein each further comprises a component at least two conductor tracks Triggering of the components are assigned, wherein next adjacent conductor tracks on each side of the base layer for mutual electrical insulation spaced apart interfaces have.
    A printed circuit board is generally a resin-pressed laminate of copper-clad plastic sheets, nowadays commonly used in epoxy resin impregnated glass fiber mats - FR4 (Flame Retardant 4) called - for the manufacture of printed circuit boards.
    The conductive pattern usually formed of copper on the top and bottom is generated photochemically by etching. The temperature resistance of such a circuit board is limited. For the standard FR4 material commonly used for printed circuit boards, the recommended operating temperature for a continuous load is approximately 120 degrees Celsius, depending on the particular glass point of the FR4. At higher temperatures, it may cause chemical reactions, delamination and bending and thus loss of electrical functionality. Likewise, the corresponding solder ages more and tends to undesired diffusion to an intermetallic zone that is more prone to cracking.
    The arranged on a circuit board components, such as LEDs, have a similar temperature limit and must be cooled accordingly or must be taken to ensure that the heat generated by these components is discharged.
    In principle, it can be so-called power components whose produced heat is to be dissipated, for example transistors.
    Not only the components can generate heat, which should be dissipated, but also the tracks themselves, if through them a sufficiently high current flows. This may result in localized destruction effects that can affect the entire circuit board and its functionality.
    The printed conductors arranged on a printed circuit board are generally conductive surfaces with different potentials, the size of a conductor surface being proportional to the heat emission to the environment, i. a larger conductor area can store more heat and also improve it by giving it a larger surface area.
    The thermal conductivity of the materials involved in the components used is in contrast to the copper of the conductors or the conductor surfaces comparatively poor.
    Most components, such as LEDs, usually do not have the required surface area for the necessary heat transfer and would be damaged during operation without adequate cooling.
    For mutual electrical insulation, the boundary surfaces of the conductor tracks or conductor surfaces of adjacent conductive tracks are spaced from one another.
    However, the interfaces of the circuit traces of a prior art printed circuit board are generally substantially rectilinear in relation to each other, so that a desired heat dissipation from one trace to a next adjacent trace to obtain a larger surface area for heat dissipation of a powered component to the environment, i. a so-called heat spreading, only inadequate can take place.
    It should be noted that for this purpose a temperature gradient or temperature gradient of the heat-emitting conductor to a next adjacent interconnect is required.
    Only by a heat transfer into or through the printed circuit board or the FR4 base layer and the local so-called heat spreading, the heat can be released usually sufficient to the environment.
    However, an ever smaller size of such circuit boards having a corresponding layout leads to problems in heat dissipation of the components arranged on a printed circuit board into or through the printed circuit board in order to release the heat by means of heat spreading.
    It is an object of the invention to provide an improved circuit board to avoid the above-mentioned disadvantages and other limitations of the prior art.
    This object is achieved in that at least the boundary surface of a conductor of the first component at least partially a first set of projections and the interface of a next adjacent conductor of the second component at least partially have a second set of projections, wherein the first set of projections and the second set Complement projections in a complementary way.
    By "complementarily complementing" in this context is generally meant that the sets of protrusions are arranged and interlock with each other such that the spacing of the respective interfaces, i. the electrically insulating distance of the next adjacent interconnects whose sets of projections intermesh substantially remains the same.
    In other words, each set of protrusions on an interface also creates "pits" that inevitably result. The protrusions of one set are placed in the resulting "depressions" of the other, such that the distances of all sides of a protrusion surrounding a "depression" are substantially constant.
    In contrast to the boundary surfaces of a conductor track of the first component and a next adjacent conductor track of the second component, which interfaces extend substantially over long distances of the circuit board rectilinear, the sets of projections according to the invention on a larger surface area of the respective interfaces, so that a mutual heat emission is favored.
    The heat-transferring boundary surfaces could, for example, be additionally increased by increasing the copper thickness of the respective printed conductor.
    Since it is generally attempted to make printed circuit boards smaller and smaller, the thermal management of such printed circuit boards continues to come to the fore, in particular in the case of printed circuit boards whose upper side and lower side are provided with conductor tracks and corresponding components and thus there is no space for any heat sinks.
    Therefore, complementarily complementary sets of protrusions allow for improved thermal management; the strip itself acts as a heat sink, the properties of which are improved by the arrangement of the projections.
    It should be noted that the terms "top and bottom" do not refer to an excellent direction or position of the circuit board, but the one for a
    Expert known specialist terminology - in English also referred to as top or bottom layer - correspond, the top and bottom facing away from each other.
    In general, by the arrangement of the conductor tracks on the top or bottom of the circuit board between the next adjacent conductor surfaces of two conductor tracks such a distance or gap formed that an electrical insulation is given with simultaneous heat transfer by heat conduction or convection.
    As already mentioned, in each case an enlarged surface is produced by the complementarily complementary projections of the next adjacent interconnects of different components, which ensures better heat transfer between two adjacent, but electrically isolated interconnects.
    As a result, not only the usually used heat transfer to the environment via or through the base layer with subsequent heat spreading, but also a heat spreading "in-plane" can be used.
    By the term "in-plane" is meant in each case the upper or the lower side of the base layer as well as the possible layers of conductor tracks on which the at least two components are arranged.
    Preferably, such projections are arranged in sections where the heat generation is highest, for example in the region or at the level of the first and / or the second component.
    In principle, it is provided that the at least two components can use the conductor track of the other in each case with the aid of the complementarily complementary projections as a heat spreading surface.
    For this, however, a temperature difference between the next adjacent interconnects of at least two components must be present, otherwise no heat transfer or heat transfer can take place in the traditional sense.
    At least two scenarios are possible so that a temperature difference can occur: 1. the at least two components have the same power inputs, the same thermal package resistances and are thermally equally well connected to the printed circuit board, 2. the at least two components have different power inputs, different thermal package resistances or are thermally differently well connected to the circuit board.
    If the at least two components correspond to item 1, a temperature difference can only occur if they are not operated in the same way. In this case, for example, it may be provided that in each case only one of the at least two components is in operation and the other is not. As a result, the conductor track or the conductor surfaces of the temporarily non-operated component can be used as a heat spreading surface for heat emission of the temporarily operated component. There is also the possibility that one component is operated at a lower power or works more efficiently than the other.
    Advantageously, at least one first layer of conductor tracks can be arranged on the top and bottom sides of the printed circuit board.
    It may be advantageous if at least a third and fourth component is arranged on the underside.
    In a practical embodiment, it can be provided that at least the boundary surface of a conductor of the third component at least partially a third set of projections and the interface of a next adjacent conductor of the fourth component at least partially have a fourth set of projections, wherein the third set of projections and the complement the fourth set of projections in a complementary way.
    Advantageously, it can be provided if the sets of projections of the respective boundary regions of the conductor tracks are formed as periodically projecting rectangles.
    Increasing the number of protruding rectangles increases the surface area from which heat is dissipated, resulting in improved heat transfer, with maximum depending on the width and length of the protrusions, generally at a width to length ratio about 1: 1 or 1: 2.
    However, a conductor area is limited in its extent by the respective strip conductor layout or printed conductor, so that only a limited number of projecting rectangles can be realized. In addition, too high a density or an excessively high number of protruding rectangles and too narrow an arrangement of the protruding rectangles can lead to thermal constrictions or a so-called "by-pass" effect between the rectangles.
    However, it may also be favorable if the sets of projections of the respective boundary regions of the conductor tracks are formed as periodically projecting teeth.
    The definitions and explanations given above also apply to the
    Embodiment with periodically projecting serrations.
    The maximum size of the projections depends strongly on the maximum size of the printed circuit board or the conductor track on which the respective projections are arranged from. Thus, the widths and lengths of the rectangles may vary, for example from 1 mm to 3 cm or from 1 mm to 6 cm. For the spikes can apply the same orders of magnitude.
    Likewise, it may be useful for the first and second sets of protrusions projecting from the respective interfaces to occupy the same area, i. that the
    Total area, which is formed by the first and second set of projections, divided in the ratio 50:50 on the sets of projections, starting from each one layer of tracks. Other ratios are possible, but not as efficient as the 50:50 split ratio.
    Advantageously, it can be provided that the first and the second set of
    Projections form a first periodic structure.
    It can also be provided that the third and the fourth set of projections form a second periodic structure.
    As already mentioned, the length of a repeating period must be periodic
    Structures and the length of the protruding structures themselves, in the above
    Examples of rectangles or serrations, be limited, because otherwise thermal
    Constrictions can come, which reduce the cooling capacity or oppose the "in-plane" heat spreading.
    Advantageously, the first periodic structure on the upper side of the printed circuit board may be arranged above the second periodic structure on the underside of the printed circuit board in such a way that the periodic structures are offset by half a period from one another and overlapping.
    By the term "overlapping" it is meant that those protruding from an interface
    Rectangles, tines or other structures of the first periodic structure and projecting from an interface rectangles, tines or other structures of the second periodic structure, however, which are offset by half a period, in a view from above the top of the circuit board or a View from below on the underside of the
    Printed circuit board are arranged one above the other.
    It can be provided that the base layer has a ceramic inlay in the region of the superimposed first and second periodic structure.
    Such a ceramic preferably promotes heat transfer through the base layer in this area.
    Furthermore, it can be advantageous if at least one second layer of conductor tracks is arranged on the upper side of the printed circuit board, wherein at least the boundary surface of a conductor track at least in sections has a first set of projections and the boundary surface of a next adjacent conductor track has at least sections a second set of projections, wherein the first set of projections and the second set of projections complement each other.
    It may likewise be advantageous if at least one second layer of conductor tracks is arranged on the underside of the circuit board, wherein at least the boundary surface of a conductor path at least in sections has a first set of projections and the boundary surface of a next adjacent conductor track has at least sections a second set of projections, wherein the first set of projections and the second set of projections complement each other.
    It may be advantageous if the first and the second set of projections of the second layer on the upper side of the printed circuit board form a second periodic structure.
    It may likewise be favorable if the first and the second set of projections of the second layer on the underside of the printed circuit board form a second periodic structure.
    It is advantageously provided that the first periodic structure of the first layer on the upper side of the printed circuit board is arranged above the second periodic structure of the second layer on the upper side of the printed circuit board in such a way that the periodic structures are offset by half a period from one another and overlapping.
    It can furthermore be advantageous if the first periodic structure of the first layer on the underside of the printed circuit board is arranged above the second periodic structure of the second layer on the underside of the printed circuit board such that the periodic structures are offset by half a period from one another and overlapping ,
    Advantageously, at least the first and the second component may be formed as an optoelectronic component.
    It can be provided that at least the first and the second components are designed as LEDs.
    In a further embodiment it can be provided that at least the first and the second component are formed as a laser diode.
    Advantageously, it can be provided that at least one operating mode is provided, in which the components can be operated alternately.
    Furthermore, it may be advantageous if the base layer is formed from an electrically insulating composite material.
    In this case, it may be favorable if the base layer is formed from FR4. Above all, printed circuit boards which do not use an additional heat sink can also be provided for the invention.
    Likewise, however, circuit boards with an additional heat sink are conceivable, for example, to relieve the heat sink. This may be, for example, an IMS (Insulated Metal Substrate) printed circuit board, which is usually made of aluminum and is provided with components only on one side with a printed circuit board layout and is usually operated with a separate heat sink.
    The invention will be explained in more detail by way of example with reference to drawings. This shows
    1 shows a detail of a printed circuit board with electrical components from the prior art,
    2 shows a section of an exemplary printed circuit board with electrical components, wherein next adjacent interconnects of the various components have a complementarily complementary, periodic structure,
    3 is a top view of the section of the circuit board of Fig. 2,
    4 is a top view through the cutout of the circuit board of FIG. 2 on the underside of the circuit board,
    5 shows a detail of the next adjacent interconnects on the upper and lower side of the exemplary printed circuit board, wherein the periodic structures of the upper or lower side, which are formed as projecting rectangles, overlap shifted by half a period,
    6 is a top view of another exemplary circuit board,
    7 is a top view through the circuit board of FIG. 6 on the underside of the circuit board,
    8 is a schematic representation of the heat development of a printed circuit board from the prior art,
    9 shows a schematic illustration of the heat development or heat spread of the exemplary printed circuit board from FIGS. 2, 3 and 4.
    10 shows a section of the next adjacent interconnects on the top and bottom of the exemplary printed circuit board, wherein the periodic structures of the top or bottom, which are formed as protruding spikes, overlap shifted by half a period,
    11 is a top view and a plan view of the detail of FIG. 10, wherein the underside is shown in dashed lines,
    Fig. 12 shows a further printed circuit board of the prior art with two layers of
    Tracks on the top,
    13 shows a printed circuit board with two layers of conductor tracks on the upper side, which layers each have a periodic structure on the interfaces, and
    14 shows a printed circuit board with two layers of conductor tracks on the upper and
    Bottom, wherein the base layer in the region of superimposed periodic
    Structures has a ceramic inlay.
    In Fig. 1 is a perspective view of a section of a printed circuit board 1 is shown in the prior art, wherein the circuit board 1 in this figure comprises a FR4 formed base layer 110 having a top and a bottom 120, 130, each having a first layer 150, 160 of provided for current conduction tracks 200, wherein the top 120 includes a first 310 and a second component 320, which are designed here as an LED. On the underside 130 of the base layer 110, a third 330 and a fourth component 340 are arranged, which, however, are not visible in the figure.
    In this case, each component 310, 320, 330, 340 is assigned in each case two printed conductors 200 with different potentials for the control, as illustrated inter alia in FIG. For mutual electrical insulation, the interconnects 200 have a boundary surface 210 spaced apart from each other, the spacing of which as a rule permits mutual heat transfer or heat exchange.
    In the event of excessive heat generation of a component, i. when temperatures are reached that oppose the optimal operation, the heat can and is mainly due to the base layer 110 and further heat spread to the
    Environment dissipated.
    2 shows an exemplary embodiment of the invention, wherein, in contrast to a circuit board 1 of the prior art, the spaced boundary surface 210 of a conductor track 200 of the first component 310 and the interface 210 of a next adjacent thereto
    Conductor 200 of the second component 320 are not rectilinear, but have a first complementary periodic structure 410, of a first and a second set of protrusions 401, 402 of the respective interfaces 210 of
    Conductor tracks 200 is formed on the top 120, wherein the sets of projections are formed as periodically projecting rectangles, as shown in Fig. 2 can be seen.
    It should be noted that due to the clarity and the other
    Explanations the figures represent only sections of a printed circuit board and it can be provided that further components and interconnects are arranged on the base layer.
    Furthermore, the terms "top and bottom" do not refer to an excellent direction or position of the circuit board, but correspond to the specialist terminology known to a person skilled in the art - also referred to as top or bottom layer in English.
    Likewise, spatial indications such as "top", "bottom", "above", "below" in terms of alignments in the figures to understand, if no additional directional statements or alignments are described to a figure.
    3 shows a view from above or a top view of the upper side 120 of the printed circuit board 100 from FIG. 2 with the first and the second component 310, 320 and the first periodic structure 410.
    On the underside 130 of the base layer 110, which is not clearly visible in FIG. 2, however, the interface 210 of a conductor 200 of the third component 330 and the interface 210 of a next adjacent conductor 200 of the fourth component 340 on the underside have a first one to each other complementary structure 420, which is also formed by the respective boundary surfaces 210 of the interconnects 200 as periodically projecting rectangles.
    4 shows a view from above or a view of the underside 130 of the printed circuit board 100 from FIG. 2 with the third and the fourth component 330, 340 as well as the first periodic structure 420 on the underside.
    The first periodic structures 410, 420 both have a defined period T, wherein the first periodic structures 410, 420 in FIG. 2 are arranged one above the other in such a way that the periodic structures are offset by half a period T from one another and overlapping.
    By the term "overlapping" it is meant that the rectangles of the first periodic structure 410 projecting from an interface 210 on the top surface 120 of the circuit board and the rectangles of the first periodic structure 420 projecting from an interface 210 of FIG
    Bottom side 130 of the circuit board, which structures, however, are offset by half a period T, in a view from above on the top 120 of the circuit board 100 and a view from above through the circuit board on the bottom 130 of the circuit board 100 are stacked.
    5 shows the conductor tracks 200 and the components 310, 320 of the top side 120 of FIG
    Circuit board 100 and the tracks 200 of the bottom 130 of the circuit board 100, wherein the base layer 110 is not shown in order to better illustrate the periodic structures 410, 420 staggered by a half period T and overlapping.
    The periodic structures 410, 420, which are in each case designed as complementary, complementary, rectangular rectangles, may also be formed as spikes projecting from the respective boundary surfaces 210, which complement each other in a complementary manner, as shown in FIGS. 6, 7, 10 and 11 is.
    6 shows a top view and a top view of the top side 120 of the printed circuit board 100 with the first and the second component 310, 320 as well as the first periodic structure 510, which in this example comprises a first and a second set of projections 501, 502 of the respective interfaces 210, wherein the sets of projections 501, 502 are formed as periodically projecting serrations.
    7 shows a view from above or a view of the underside 130 of the printed circuit board 100 with the third and the fourth component 330, 340 as well as the first periodic structure 520 on the underside of the printed circuit board, which in this example is from the respective interfaces 210 periodically projecting teeth is formed.
    In the preferred embodiment shown in the figures, but not by way of limitation, the first and second components 310, 320 are LED, operating in an operating mode in which only one of the LEDs is active at a time or switched on and the other is inactive or switched off.
    In this operating mode, which is illustrated in each case in FIGS. 8 and 9, it is ensured that the interconnects 200 assigned to the respective inactive or switched-off LED have a lower temperature than the interconnects 200 which are assigned to the respective active or switched-on LED.
    For this purpose, FIG. 8 shows a view from above or a top view of the top side 120 of FIG
    Prior art printed circuit board 1 with an active first LED 310 whose activity is represented by a hatching directed from the bottom left, to the top right, and an inactive or second LED 320. For further explanation, printed conductors 200, which are assigned to the first component or the first LED 310, also as the first conductor pair 201 and conductor tracks 200 which are assigned to the second component or the second LED 320, as well as second
    Conductor pair 202 denotes.
    The conductor pair 201 heated by the operation of the first LED 310 is characterized by hatching directed from top left to bottom right.
    It has been found that the boundary surfaces of the pairs of interconnects 201, 202, which are spaced apart from each other in the prior art, which border surfaces are substantially rectilinear, do not ensure sufficient mutual heat transfer, so that, as in the example of FIG. 8, the first interconnect pair 201 Heat can not transfer across the spaced apart interfaces of the conductive pattern pairs 201, 202, even if, as in the example of FIG. 8, the second conductive pattern pair 202 has a lower temperature than the first one due to the inactive LED 320
    Conductor pair 201.
    In contrast, FIG. 9 shows a view from above or a top view of the upper side 120 of the printed circuit board 100 with an active or switched first LED 310, whose
    Activity is shown by a hatching directed from the bottom left, to the top right, and an inactive or off second LED 320, wherein the inventive first periodic structure 410 on the top 120 of the circuit board - here as from the
    Formed interfaces 210 projecting, complementary to each other complementary rectangles - a heat transfer of the first conductor pair 201, which through the
    Operation of the first LED 310 has a higher temperature than the second conductor pair 202 and as shown in Fig. 8 by a top left, down to the right hatching, allows for the first conductor pair 201 next adjacent conductor 200 of the second conductor pair 202, which is also characterized by hatching directed from top left to bottom right.
    The heat transfer is made possible by the increased surface area of the respective boundary surfaces 201 of the next adjacent interconnect pairs 201, 202.
    It should be noted that in addition to the operating mode described above, other operating modes are possible as long as the conductor track pairs 201, 202 have a different high temperature, ie a temperature gradient between the conductor track pairs 201, 202 is present.
    For example, it may be provided that one LED is operated dimmed, whereas the other LED is operated with maximum luminosity. Furthermore, it can be provided that the first component is different from the second component, wherein the two components have a different high maximum operating temperature.
    FIG. 10 shows, like FIG. 5, the printed conductors 200 and the components 310, 320 of the upper side 120 of the printed circuit board 100 and the printed conductors 200 of the lower side 130 of the printed circuit board, wherein the base layer 110 and the components 330, 340 of the lower side 130 are not illustrated. The periodic structures 510, 520 are in this case formed as projecting points of the respective interfaces 210, the periodic structures overlapping offset by a half period T.
    For better illustration, FIG. 11 shows the circuit board arrangement from FIG. 10 in a view from above, with the first periodic structure 520 of the underside 130 being shown in dashed lines.
    12 shows a further printed circuit board 2 from the prior art with a first and a second component 310, 320, wherein a second layer 151 of printed conductors 200 is arranged on the upper side of this printed circuit board.
    13 shows a section of a printed circuit board with an additional second layer 151 on the upper side of the printed circuit board 100 and a first and second component 310, 320, the interfaces 210 of the first and second layers 150, 151 of printed conductors 200 on the upper side 120 each having a first and a second set of protrusions 401, 402, 405, 406, each forming a periodic structure 410, 411 having a period T, wherein the sets of protrusions 401, 402 of the first layer 150 in this figure do not and wherein the first periodic structure 410 of the first layer 150 on the upper side 120 of the printed circuit board 100 is arranged in such a way to the second periodic structure 411 of the second layer 151 on the upper side 120 of the printed circuit board 100 that the periodic structures 410, 411 um half a period T offset from each other and are arranged overlapping.
    The same situation also applies in FIG. 14 to the first and second layers 160, 161 on the underside 130 of the printed circuit board, wherein the periodic structures 411, 421 of the respective second layers 160 of the upper and lower sides 120, 130 are arranged one above the other in that the periodic structures 411, 421 are offset by half a period T from one another and overlapping.
    In addition, it may be provided that a ceramic inlay 600 is arranged in the base layer 110 in the region of the superimposed periodic structures 410, 411, 420, 421, as shown in FIG. 14.
    LIST OF REFERENCE NUMBERS
    PCB from the
    State of the art .. 1, 2
    PCB ... 100
    Base layer. 110
    Top. 120
    Bottom. 130
    First location interconnects. 150, 160
    Second layer of tracks. 151, 161
    Trace. 200 first interconnect pair. 201 second interconnect pair. 202
    Interface. 210
    Components. 310, 320, 330, 340 rectilinear structure. 400 first sets of protrusions on the top. 401, 405, 501 second sets of protrusions on the top. 402, 406, 502 first sets of protrusions on the bottom. 403, 503 second sets of protrusions on the bottom. 404, 504 first periodic structure. 410, 420, 510, 520 second periodic structure. 411, 421
    Ceramic inlay. 600
    权利要求:
    Claims (23)
    [1]
    A printed circuit board (100), comprising a base layer (110) having a top and a bottom (120, 130), wherein at least the top (120) at least a first layer (150) of conductor tracks (200) provided for current conduction and at least a first and a second electrical component (310, 320), wherein in each case one component (310, 320, 330, 340) at least two conductor tracks (200) are assigned for driving the components, wherein next adjacent conductor tracks (200) on each one side (120, 130) of the base layer (110) for mutual electrical insulation spaced apart interfaces (210), characterized in that at least the interface (210) of a conductor (200) of the first component (310) at least partially a first set Projections (401, 405, 501) and the interface (210) of a next adjacent conductor track (200) of the second component (320) at least in sections a second set of projections (402, 406, 502) aufwei sen, wherein the first set of projections (401, 405, 501) and the second set of projections (402, 406, 502) complement each other.
    [2]
    2. Printed circuit board according to claim 1, characterized in that on the upper and lower sides (120, 130) of the printed circuit board at least a first layer (150, 160) is arranged by conductor tracks.
    [3]
    3. Printed circuit board according to claim 2, characterized in that on the underside (130) at least a third and fourth component (330, 340) are arranged.
    [4]
    4. Printed circuit board according to claim 3, characterized in that at least the boundary surface (210) of a conductor track (200) of the third component (330) at least partially a first set of projections (403, 503) and the interface (210) of a next adjacent conductor track (200) of the fourth component (340) at least in sections a second set of projections (404, 504), wherein the first set of projections (403, 503) and the second set of projections (404, 504) complement each other.
    [5]
    5. The printed circuit board according to claim 1, wherein the first and the second set of projections (401, 402, 501, 502) of the at least one first layer (150) on the upper side (120) of the printed circuit board has a first form a periodic structure (410, 510) with a period (T).
    [6]
    6. The printed circuit board according to claim 4 or 5, characterized in that the first and the second set of projections (403, 404, 503, 504) of the at least one first layer (160) on the underside (130) of the printed circuit board has a first periodic structure (420, 520) with a period (T).
    [7]
    7. Printed circuit board according to one of claims 1 to 6, characterized in that the sets of projections (401, 402, 403, 404) of the respective boundary surfaces (210) of the conductor tracks (200) are formed as projecting rectangles.
    [8]
    8. Printed circuit board according to one of claims 1 to 6, characterized in that the sets of projections (501, 502, 503, 504) of the respective interfaces (210) of the conductor tracks (200) are formed as protruding teeth.
    [9]
    9. Printed circuit board according to one of claims 5 to 8, characterized in that the first periodic structure (410, 510) of the at least one first layer (150) on the upper side (120) of the printed circuit board (100) above the first periodic structure ( 420, 520) of the at least one first layer (160) is arranged on the underside (130) of the printed circuit board (100) such that the periodic structures (410, 420, 510, 520) offset by half a period (T) and overlapping are arranged.
    [10]
    10. Printed circuit board according to claim 9, characterized in that the base layer (110) in the region of the superimposed first periodic structure (410, 420, 510, 520) has a ceramic inlay.
    [11]
    11. Printed circuit board according to one of claims 1 to 10, characterized in that on the upper side (120) of the printed circuit board further at least a second layer (151) of printed conductors (200) is arranged, wherein at least the boundary surface (210) of a conductor track (200 ) at least in sections a first set of projections (405) and the interface (210) of a next adjacent trace (200) at least partially a second set of projections (406), wherein the first set of projections (405) and the second set of projections (405) 406) complementary complement.
    [12]
    12. Printed circuit board according to one of claims 2 to 11, characterized in that on the underside (130) of the printed circuit board further at least a second layer (161) of printed conductors (200) is arranged, wherein at least the boundary surface (210) of a conductor track (200 ) at least in sections a first set of projections and the interface (210) of a next adjacent conductor track (200) at least partially a second set of projections, wherein the first set of projections and the second set complement each other complementary projections.
    [13]
    The printed circuit board according to claim 11 or 12, characterized in that the first and second sets of projections (405, 406) of the second layer (151) on the upper side (120) of the printed circuit board have a second periodic structure (411) with one period Form (T).
    [14]
    14. The printed circuit board according to claim 11, wherein the first and the second set of projections of the second layer on the underside of the printed circuit board have a second periodic structure with a period form.
    [15]
    15. Circuit board according to claim 14, characterized in that the first periodic structure (410) of the first layer (150) on the upper side (120) of the printed circuit board (100) in such a way to the second periodic structure (411) of the second layer (151). is arranged on the upper side (120) of the printed circuit board (100) such that the periodic structures (410, 411) are offset by half a period (T) from one another and overlapping.
    [16]
    16. Printed circuit board according to claim 14 or 15, characterized in that the first periodic structure (420) of the first layer (160) on the underside (130) of the printed circuit board (100) to the second periodic structure (421) of the second layer ( 161) is arranged on the underside (130) of the printed circuit board (100) such that the periodic structures (420, 421) are offset by half a period (T) from one another and overlapping.
    [17]
    17. Printed circuit board according to one of claims 1 to 16, characterized in that at least the first and / or the second component (310, 320) is formed as an optoelectronic component.
    [18]
    18. Printed circuit board according to claim 17, characterized in that at least the first and / or the second component (310, 320) is designed as an LED.
    [19]
    19. Printed circuit board according to claim 17, characterized in that at least the first and / or the second component (310, 320) is designed as a laser diode.
    [20]
    20. Printed circuit board according to one of claims 17 to 19, characterized in that at least one operating mode is provided, in which the components (310, 320) are alternately operable.
    [21]
    21. Printed circuit board according to one of claims 1 to 20, characterized in that the base layer (110) is formed of an electrically insulating composite material.
    [22]
    22. Printed circuit board according to one of claims 1 to 21, characterized in that the base layer (110) is formed from FR4.
    [23]
    23. A motor vehicle headlight comprising one or more circuit boards (100) according to one of claims 1 to 22.
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    同族专利:
    公开号 | 公开日
    AT519741B1|2018-10-15|
    EP3432692A1|2019-01-23|
    CN109273575B|2021-04-02|
    EP3432692B1|2020-06-10|
    CN109273575A|2019-01-25|
    引用文献:
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    DE102010062944A1|2010-12-13|2012-06-14|Zf Friedrichshafen Ag|Printed circuit board for control device of motor vehicle, has enlarged planar surface that is formed at side surface opposite to planar surface of surface structure formed apart from function structure of board main portion|
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    US20110309381A1|2010-06-21|2011-12-22|Toshiba Lighting & Technology Corporation|Light-emitting device and lighting apparatus|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50601/2017A|AT519741B1|2017-07-18|2017-07-18|Thermal coupling of copper expansion surfaces|ATA50601/2017A| AT519741B1|2017-07-18|2017-07-18|Thermal coupling of copper expansion surfaces|
    EP18178017.2A| EP3432692B1|2017-07-18|2018-06-15|Thermal coupling of copper heat spreading surfaces|
    CN201810789611.7A| CN109273575B|2017-07-18|2018-07-18|Conductor plate and motor vehicle headlight|
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